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Indium Corporation’s Cu sinter paste InBAKE 29 (76-29-6) is developed for high-powerdie-attach applications and for applications requiring high thermal conductivity, highelectrical conductivity, and high service/operating temperature.
Stock available on 31 December 2024, if ordered today
Price on Application
Indium Corporation’s Cu sinter paste InBAKE 29 (76-29-6) is developed for high-powerdie-attach applications and for applications requiring high thermal conductivity, highelectrical conductivity, and high service/operating temperature.
InBAKE 29 can be sinteredeither pressure-less or with pressure, under low oxygen atmospheres of O2 <1,000ppm. After4,500 cycles TCT (-40°C–175°C), the die shear strength increases compared to time zero.InBAKE 29 target applications include high-power die-attach (SiC MOSFET and Si IGBT), RFdie-attach. and power LED die-attach.Features• Pressure-less / Pressure sinter-able• Used on Cu, Ag, Au, and Ni finished surfaces• Stencil printing or dispensable• High electrical conductivity• High thermal conductivity• RoHS compliable• Long shelf life, long work life• Metal load 82–85%• Paste typical viscosity 20–30Kcp (5rpm, cone and plateviscometer)• Shear strength >25MPa (pressure-less sinter);>50MPa (apply 5MPa sinter pressure)
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
