BERGQUIST GAP PAD TGP 2000
Product Information
BERGQUIST GAP PAD TGP 2000 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps with stepped topography, rough surfaces and high stack-up tolerances.It is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly
- Thermal Conductivity: 2.0 W/m-K
- Low “S-Class” thermal resistance at very low pressures
- Designed for low-stress applications
- Highly Conformable, low hardness
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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