BERGQUIST GAP FILLER TGF 1100SF
Product Information
BERGQUIST GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
- Thermal conductivity: 1.1 W/m-k
- Silicone free
- Room temperature as well as accelerated curing possible
- UL94 V-0 compliance
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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