BERGQUIST GAP FILLER TGF 1000SR
Product Information
BERGQUIST GAP FILLER TGF 1000SR is a two component silicone based thermally conductive, liquid gap filling material that features superior slump resistance. The mixed system will cure at room temperature and can be accelerated with the addition of heat. When cured this product provides a soft, thermally conductive,form-in place elastomer that is ideal for fragile assemblies, capable of filling unique and intricate air voids and gaps. This product is intended for use in automotive electronics applications where a strong structural bond is not necessary
- Excellent slump resistance (stays in place)
- Excellent low and high temperature mechanical and chemical stability
- Ultra-conforming, with excellent wet-out for low stress interface applications
- Thermal Conductivity: 1.0 W/m-K
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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