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BERGQUIST SIL PAD TSP Q2500
Product Information
The material is designed for those applications in which maximum heat transfer is needed and electrical isolation is not required. BERGQUIST SIL PAD TSP Q2500 is the ideal thermal interface material to replace messy thermal grease compounds. BERGQUIST SIL PAD TSP Q2500 eliminates problems associated with grease such as contamination of reflow solder or cleaning operations. Unlike grease, BERGQUIST SIL PAD TSP Q2500 can be used prior to these operations. BERGQUIST SIL PAD TSP Q2500 also eliminates dust collection which can cause possible surface shorting or heat buildup.
- Thermal impedance: 0.22°C-in2/W (@50 psi)
- Maximum heat transfer
- Designed to replace thermal grease
- Aluminum foil coated both sides
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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