BERGQUIST SIL PAD TSP Q2000

BERGQUIST SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths.

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From £0.26 Excl VAT £0.31 incl VAT

BERGQUIST SIL PAD TSP Q2000 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths.

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Product Information

BERGQUIST SIL PAD TSP Q2000, Fiberglass-Reinforced, Silicone based, Grease Replacement Thermal Interface

BERGQUIST SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without worry. When clamped between two surfaces, the elastomer conforms to surface textures thereby creating and air-free interface between heat-generating components and heat sinks. Fiberglass reinforcement enables BERGQUIST SIL PAD TSP Q2000 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

Thermal impedance: 0.35°C-in2/W (@50 psi)
Eliminates processing constraints typically associated with grease
Easy handling
Conforms to surface textures

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.