- Home
- Adhesives
- Thermal Sil Pad Materials
- BERGQUIST SIL PAD TSP 1750 (C98130-A7578-C21-51-6)
BERGQUIST SIL PAD TSP 1750 (C98130-A7578-C21-51-6)
BERGQUIST SIL PAD TSP 1750 is designed to be an economical material solution for high humidity, high dielectric requirements.
Product Information
The combination of high thermal conductivity and excellent dielectric strength retention after humidity exposure is formulated into the BERGQUIST SIL PAD TSP 1750 elastomeric pad. The material transfers heat due to its high loading of speciality ceramics and its ability to exclude air from large interfaces. BERGQUIST SIL PAD TSP 1750 relies on new processes that minimize the effect of high humidity on the electrical properties of the finished material. Therefore, exposure to humid environments during assembly, or over long-term operating conditions, will not severely affect the ability of the material to perform.
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
Video
No video available.
Similar Products
You May Be Interested In
Recently Viewed
There are no recently viewed products.