BERGQUIST GAP PAD TGP HC5000

BERGQUIST GAP PAD TGP HC5000 is a silicone-based, thermally conductive, and highly conforming gap pad filler designed for high performance applications.

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From £0.16 Excl VAT £0.19 incl VAT

BERGQUIST GAP PAD TGP HC5000 is a silicone-based, thermally conductive, and highly conforming gap pad filler designed for high performance applications.

+ More Details

Datasheets Properties Video DELIVERY

Product Information

BERGQUIST GAP PAD TGP HC5000 is a pre-cured silicone and fiberglass reinforced material with a thermal conductivity rating of 5 W/m-K. The extremely soft and flexible material offers excellent thermal performance at low pressures and easily conforms to rough and irregular surfaces allowing for exceptional wet-out characteristics at the interface. The material has a natural inherent tack on both sides that reduces the need for additional bulky adhesive layers and comes with protective liners on both side for easy handling.

Silicone-based
Fiberglass reinforced for shear and tear resistance
Thermal conductivity: 5 W/m-K
High compliance, low compression stress

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.