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Properties
Specifications
Brand
BERGQUIST
Packed With Dry Ice
no
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Manuals
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Manuals
BERGQUIST GAP PAD TGP 2200SF TDS
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Version TDS
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ConRo Electronics Ltd cannot ensure and do not guarantee that the information in these documents is the most current available from the manufacturer. There are instances when updates are released without our immediate knowledge.
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BERGQUIST GAP PAD TGP 2200SF is a green, silicone-free, gap pad filling material with good thermal conductivity and designed for silicone-sensitive applications.
BERGQUIST GAP PAD TGP 2200SF is a green, silicone-free, gap pad filling material with good thermal conductivity and designed for silicone-sensitive applications.
BERGQUIST GAP PAD TGP 2200SF is ideal for applications with uneven topologies and high stack-up tolerances. Reinforced with fibreglass for easy handling and durability, this product is offered with a protective liner and reduced tack on one side for burn-in processes and easy rework.
Thermally conductive 2.0 W/m-K
Silicone-free formulation
Medium compliance with easy handling
Electrically isolating
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
