LOCTITE ECCOBOND E 1172 A

LOCTITE ECCOBOND E 1172 A is a single component underfill for use with very fine area array devices where SMT transparent processing is critical.

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From £264.56 Excl VAT £317.47 incl VAT

LOCTITE ECCOBOND E 1172 A is a single component underfill for use with very fine area array devices where SMT transparent processing is critical.

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Datasheets Properties Video DELIVERY

Product Information

LOCTITE ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects. This product cures fast at low temperatures and exhibits low CTE with long pot life.

Void free underfill
Single component
Long pot life
Fast Cure

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.