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Specifications
Brand
Indium
Packed With Dry Ice
no
Downloads
Manuals
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Download
Manuals
Indium Corp Lead Free Solder Paste 8.9HFA SAC305 Type 4 88.5% TDS
Revision
Version TDS
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ConRo Electronics Ltd cannot ensure and do not guarantee that the information in these documents is the most current available from the manufacturer. There are instances when updates are released without our immediate knowledge.
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Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
Indium8.9HFA is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders.
Indium8.9HFA offers unprecedented stencil print transfer efficiency to work in the broadest range of processes.Composition: Sn96.5 Ag3 Cu.5. (SAC305)
Features
Eliminates clogged apertures through advanced rheology
High speed printing (>100mm/second capable)
Eliminates hot and cold slump
Excellent wetting
High oxidation resistance
Halogen-free per EN14582 test method
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
