BERGQUIST LIQUI FORM TLF 10000
Product Information
Specially designed for the Data & Telecom Market
BERGQUIST LIQUI FORM TLF 10000 thermally conductive gel interface material is designed to meet the demanding requirements in telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. BERGQUIST LIQUI FORM TLF 10000 is pre-cured, requiring no mixing or refrigeration.
- Thermal Conductivity, ASTM D5470, 10 W/(m-K)
- Excellent thermal cycling performance & dispense properties
- Low thermal impedance
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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