DOWSIL Q1-9226 Thermally Conductive Adhesive

Dowsil Q1-9226 is a two component, heat-curing thermally conductive adhesive. Ideal for a diverse range of substrates, including filled plastics, metals, epoxies, laminate boards, and ceramics, this silicone adhesive is engineered to deliver exceptional thermal conductivity. Typical applications include bonding ceramic substrates to heat sinks for electronic control modules in the automotive industry.

Dowsil Q1-9226 facilitates optimal heat dissipation, ensuring the longevity and efficiency of electronic components. The adhesive is self priming, semi-flowable, and has a long pot life, simplifying the application process for users. Operational over a temperature range of -45 to 200°C for prolonged periods, Dowsil Q1-9226 Thermally Conductive Adhesive provides durability and reliability in diverse operating conditions.

• 1:1 mixing ratio
• Accelerated heat cure
• Self priming adhesion to a variety of substrates
• Low thermal resistance and high thermal conductivity
• Long pot life for ease of use

How to use Dowsil Q1-9226 Thermally Conductive Adhesive:

1. Thoroughly mix base and curing agent, in a 1:1 mixing ratio, either by weight or volume.
2. If air bubbles are still present after mix, vacuum de-airing may be required.
3. Dow primers can be used to increase the chemical activity on difficult substrates before applying the adhesive. For best results, the primer should be applied in a very thin, uniform coating.
4. Apply Dowsil Q1-9226 Thermally Conductive Adhesive by automated or manual dispensing.
5. Dowsil Q1-9226 should be heat cured at 100°C or above. Curing time is 30 minutes at 150 °C, 60 minutes at 100 °C.

Storage

Store Dowsil Q1-9226 Thermally Conductive Adhesive in the unopened container to avoid any contamination. Store in accordance with any special instructions listed on the product label.