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Properties
Specifications
Size
EACH
Brand
BERGQUIST
MPN
2605483
Commodity Code
85472000
Country Of Origin
United States of America
Categorisation
Non-hazardous
Packed With Dry Ice
no
Downloads
Manuals
Revision
Download
Manuals
BERGQUIST GAP PAD TGP 2200SF TDS
Revision
Version TDS
Download
ConRo Electronics Ltd cannot ensure and do not guarantee that the information in these documents is the most current available from the manufacturer. There are instances when updates are released without our immediate knowledge.
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BERGQUIST GAP PAD TGP 2200SF is a green, silicone-free, gap pad filling material with good thermal conductivity and designed for silicone-sensitive applications.
Stock available on 03 February 2025, if ordered today
£1.47 Excl VAT£1.76 incl VAT
BERGQUIST GAP PAD TGP 2200SF is a green, silicone-free, gap pad filling material with good thermal conductivity and designed for silicone-sensitive applications.
BERGQUIST GAP PAD TGP 2200SF is a thermally conductive and electrically isolating thermal interface material that is ideal for applications with uneven topologies and high stackup tolerances. Reinforced with fiberglass for easy handling and durability, this product is offered with a protective liner and reduced tack on one side for burn-in processes and easy rework.
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
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