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A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 12.0 W/m-K and ultra low modulus (ULM).
A high performance, thermally conductive, silicone-based gap pad filler with an exceptional thermal conductivity rating of 12.0 W/m-K and ultra low modulus (ULM).
BERGQUIST GAP PAD TGP 12000ULM is an extremely soft, ultra low modulus (ULM) resin material with a unique filler package, which provides excellent thermal performance at low pressures. The flexibility of the material easily conforms to rough or irregular surfaces, allowing exceptional wet-out characteristics at the interface while protective liners on both sides allow for easy application.
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
