BERGQUIST GAP PAD TGP 2000

BERGQUIST GAP PAD TGP 2000 is a silicone based, highly conformable, thermally conductive, reinforced “S-Class” gap filling material.

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From £0.22 Excl VAT £0.26 incl VAT

BERGQUIST GAP PAD TGP 2000 is a silicone based, highly conformable, thermally conductive, reinforced “S-Class” gap filling material.

+ More Details

Datasheets Properties Video DELIVERY

Product Information

BERGQUIST GAP PAD TGP 2000 is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps with stepped topography, rough surfaces and high stack-up tolerances.It is offered with inherent natural tack on both sides of the material allowing for stickin-place characteristics during application assembly

Thermal Conductivity: 2.0 W/m-K
Low “S-Class” thermal resistance at very low pressures
Designed for low-stress applications
Highly Conformable, low hardness

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.