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Properties
Specifications
Brand
BERGQUIST
Packed With Dry Ice
no
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Manuals
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Manuals
BERGQUIST GAP FILLER TGF 3010APS TDS
Revision
Version TDS
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ConRo Electronics Ltd cannot ensure and do not guarantee that the information in these documents is the most current available from the manufacturer. There are instances when updates are released without our immediate knowledge.
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BERGQUIST® GAP FILLER TGF 3010APS is a two component, silicone free dispensable liquid with an extremely high dispense rate of 80 cc/sec curable at room temperature. With unique combination of high dispense rate, good thermal conductivity and low compressive stress it is ideal for high throughput applications like automotive power storage systems in the automotive industry.
Thermal conductivity: 3.0 W/m-K
Non-silicone gap filler
Fast dispense rate: > 80 cc/sec
Compressable (shore OO 75)
Room temperature cure
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
