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BERGQUIST
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BERGQUIST GAP FILLER TGF 3000SF TDS
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BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free, room temperature curable gap filler designed for use in high throughput assembly applications.
BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free, room temperature curable gap filler designed for use in high throughput assembly applications.
BERGQUIST GAP FILLER TGF 3000SF is a 2-part silicone-free gap filler that is curable at room temperature and is suitable for use in high throughput assembly applications. With a 3.0 W/m-K thermal performance, it provides an excellent solution in the assembly of high-performance power devices.
Thermal Conductivity: 3.0 W/m-K
Dispensable liquid, 2K Silicone free Gap Filler
Room temperature cure - no oven required
Low compression stress during assembly
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
