LOCTITE ECCOBOND UF 1173

LOCTITE ECCOBOND UF 1173 is a single-component product designed to provide a uniform and void-free encapsulant underfill.

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From £196.53 Excl VAT £235.84 incl VAT

LOCTITE ECCOBOND UF 1173 is a single-component product designed to provide a uniform and void-free encapsulant underfill.

+ More Details

Datasheets Properties Video DELIVERY

Product Information

LOCTITE ECCOBOND UF 1173 is an epoxy-based, single-component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.

Single component
Void free underfill
Long pot life
Low CTE

Delivery Information

FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).

International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.

Please refer to our World Wide Delivery page for more information including countries served and delivery options.