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- LOCTITE ECCOBOND FP4549 - 10CC Syringe
LOCTITE ECCOBOND FP4549 - 10CC Syringe
Product Information
This material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.
Product Benefits
- High purity
- Low stress
- Low moisture absorption
- Extends thermal cycling performance
- Dissipates stress on solder joints
- Improved JEDEC performance
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Delivery page for more information including countries served and delivery options.
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