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Properties
Specifications
Brand
BERGQUIST
Packed With Dry Ice
no
Downloads
Manuals
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Manuals
BERGQUIST GAP PAD TGP 12000 TDS
Revision
Version TDS
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ConRo Electronics Ltd cannot ensure and do not guarantee that the information in these documents is the most current available from the manufacturer. There are instances when updates are released without our immediate knowledge.
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BERGQUIST GAP PAD TGP 12000 is a soft gap filling material rated at a thermal conductivity of 12 W/m-K. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. The material offers exceptional thermal performance at low pressures. BERGQUIST GAP PAD TGP 12000 is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface. Protective liners are supplied on both sides allowing for ease of use.
Thermal conductivity of 12 W/m-K.
Highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface
Low compression stress
Delivery Information
FREE UK Mainland delivery for orders over £100.00 (orders placed through the office will incur delivery charges).
International delivery is available to over 100 countries worldwide. Shipping is automatically calculated based on the weight, location and hazardous nature of the goods. Customers can also choose ex works to arrange their own collection should they prefer.
Please refer to our World Wide Deliverypage for more information including countries served and delivery options.
